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  Datasheet File OCR Text:
 2N5638, 2N5639
2N5638 is a Preferred Device
JFET Chopper Transistors
N-Channel - Depletion
N-Channel Junction Field Effect Transistors, depletion mode (Type A) designed for chopper and high-speed switching applications.
Features
* Low Drain-Source "ON" Resistance: RDS(on) = 30W for 2N5638
RDS(on) = 60W for 2N5639
http://onsemi.com
1 DRAIN
* Low Reverse Transfer Capacitance - * Fast Switching Characteristics - tr = 5.0 ns (Max) (2N5638) * Pb-Free Packages are Available*
MAXIMUM RATINGS
Rating Drain -Source Voltage Drain -Gate Voltage Reverse Gate -Source Voltage Forward Gate Current Total Device Dissipation @ TA = 25C Derate above 25C Storage Temperature Range Operating Junction Temp Range Symbol VDS VDG VGSR IGF PD 310 2.82 Tstg TJ -65 to +150 -65 to +135 mW mW/C C C 12 3 Value 30 30 30 10 Unit Vdc Vdc Vdc mAdc
Crss = 4.0 pF (Max) @ f = 1.0 MHz
3 GATE
2 SOURCE
MARKING DIAGRAM
TO-92 CASE 29 STYLE 5
2N 563x AYWW G G
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. VDD = 10 Vdc 50 0.1 mF TO 50 W 0.001 mF SCOPE B + -
V RL + DD * (RDS(on) ) 50) ID PULSE GENERATOR INPUT (SCOPE A) 10% 90% td(on) tf td(off) 90% 10% OUTPUT (SCOPE B) 50
x = 8 or 9 A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device 2N5638RLRA 2N5638RLRAG Package TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) TO-92 TO-92 (Pb-Free) Shipping 2000/Tape & Reel 2000/Tape & Reel 1000 Units/Box 1000 Units/Box 2000/Tape & Reel 2000/Tape & Reel
RL
VGS(on) VGS(off) 1.0 k tr 50 50 W TO 50 W SCOPE A SCOPE TEKTRONIX 567A OR EQUIVALENT
2N5639 2N5639G 2N5369RLRA 2N5369RLRAG
Figure 1. Switching Times Test Circuit
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
1
March, 2006 - Rev. 4
Publication Order Number: 2N5638/D
2N5638, 2N5639
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Gate -Source Breakdown Voltage (IG = -1.0 mAdc, VDS = 0) Gate Reverse Current (VGS = -15 Vdc, VDS = 0) (VGS = -15 Vdc, VDS = 0, TA = 100C) Drain-Cutoff Current (VDS = 15 Vdc, VGS = -12 Vdc) (VDS = 15 Vdc, VGS = -12 Vdc, TA = 100C) (VDS = 15 Vdc, VGS = -8.0 Vdc) (VDS = 15 Vdc, VGS = -8.0 Vdc, TA = 100C) ON CHARACTERISTICS Zero-Gate-Voltage Drain Current (Note 1) (VDS = 20 Vdc, VGS = 0) Drain-Source "ON" Voltage (ID = 12 mAdc, VGS = 0) (ID = 6.0 mAdc, VGS = 0) Static Drain-Source "ON" Resistance (ID = 1.0 mAdc, VGS = 0) SMALL-SIGNAL CHARACTERISTICS Static Drain-Source "ON" Resistance (VGS = 0, ID = 0, f = 1.0 kHz) Input Capacitance (VDS = 0, VGS = -12 Vdc, f = 1.0 MHz) Reverse Transfer Capacitance (VDS = 0, VGS = -12 Vdc, f = 1.0 MHz) RDS(on) 2N5638 2N5639 Ciss Crss - - - - 30 60 10 4.0 pF pF W 2N5638 2N5639 2N5638 2N5639 RDS(on) 2N5638 2N5639 - - 30 60 IDSS VDS(on) - - 0.5 0.5 W 50 25 - - mAdc Vdc 2N5638 2N5638 2N5639 2N5639 V(BR)GSS IGSS 35 - - 1.0 1.0 Vdc nAdc mAdc mAdc 1.0 1.0 1.0 1.0 Symbol Min Max Unit
ID(off)
-
SWITCHING CHARACTERISTICS (VDD = 10 Vdc, VGS(on) = 0, VGS(off) = -10 Vdc, RG' = 50 W. See Figure 1 on page 1) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time 1. Pulse Width 300 ms, Duty Cycle 3.0%. ID(on) = 12 mAdc, 2N5638 ID(on) = 6.0 mAdc, 2N5639 ID(on) = 12 mAdc, 2N5638 ID(on) = 6.0 mAdc, 2N5639 ID(on) = 12 mAdc, 2N5638 ID(on) = 6.0 mAdc, 2N5639 ID(on) = 12 mAdc, 2N5638 ID(on) = 6.0 mAdc, 2N5639 td(on) tr td(off) tf - - - - - - - - 4.0 6.0 5.0 8.0 5.0 10 10 20 ns ns ns ns
http://onsemi.com
2
2N5638, 2N5639
PACKAGE DIMENSIONS TO-92 (TO-226) CASE 29-11 ISSUE AL
A R P L
SEATING PLANE
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 ---
K
XX G H V
1
D J C SECTION X-X N N
DIM A B C D G H J K L N P R V
STYLE 5: PIN 1. DRAIN 2. SOURCE 3. GATE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
http://onsemi.com
3
2N5638/D


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